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Publisher : elsevier ltd Publication : microelectronics reliability
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Academic Journal

Elemental characterisation of sub 20 nm structures in devices using new SEM-EDS technology

  • Source: In Microelectronics Reliability September 2016 64:367-369

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Academic Journal

Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis

  • Source: In Microelectronics Reliability January 2016 56:162-169

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Academic Journal

Semiconductor material analysis based on microcalorimeter EDS

  • Source: In Microelectronics Reliability 2003 43(9):1675-1680

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Academic Journal

Heavy ion irradiation effects on GaN/AlGaN high electron mobility transistor failure at off-state

  • Source: In Microelectronics Reliability November 2019 102

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Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper

  • Source: In Microelectronics Reliability July 2020 110

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Academic Journal

Advanced FIB sample preparation techniques for high resolution TEM investigations of HEMT structures

  • Source: In Microelectronics Reliability September-October 2014 54(9-10):1785-1789

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Academic Journal

Study on high power microwave nonlinear effects and degradation characteristics of C-band low noise amplifier

  • Source: In Microelectronics Reliability January 2022 128

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Academic Journal

Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints

  • Source: In Microelectronics Reliability December 2021 127

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Academic Journal

Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints

  • Source: In Microelectronics Reliability December 2021 127

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Academic Journal

A novel material detection method using femtosecond laser, confocal imaging and image processing enabling endpointing in fast inspection of microelectronics

  • Source: In Microelectronics Reliability November 2021 126

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  • 1-10 of  49 results for "eds"