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Conference

New Routine to Determine Microstructures of Metallic Interconnectors Using SEM-EBSD Technique

  • Source: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2021

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Conference

Influence of Ce Content on the Microstructure and Microhardness of Injection Casting Al-Cu-Fe Alloys

  • Source: 2021 3rd International Academic Exchange Conference on Science and Technology Innovation (IAECST) Science and Technology Innovation (IAECST), 2021 3rd International Academic Exchange Conference on.

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Conference

Experimental Study on the Laser Cladding of 316L / 316L / Stellite 6 / Stellite6 / H13 + 20% Ni60 Gradient Composite Coating on H13 Steel

  • Source: 2021 3rd International Academic Exchange Conference on Science and Technology Innovation (IAECST) Science and Technology Innovation (IAECST), 2021 3rd International Academic Exchange Conference on.

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Conference

Fabrication, microstructural characterization and wear characteristics of A380 alloy-alumina composites

  • Source: 2015 International Conference on Electrical & Electronic Engineering (ICEEE) Electrical & Electronic Engineering (ICEEE), 2015 International Conference on. :269-272 Nov, 2015

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Conference

Optimization of termite mound soil through alkali activation and cement stabilisation for sustainable and eco-friendly construction materials

  • Source: 2021 1st International Conference on Multidisciplinary Engineering and Applied Science (ICMEAS) Multidisciplinary Engineering and Applied Science (ICMEAS), 2021 1st International Conference on. :1-5

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Academic Journal

Influence of RE-Based Liquid Source (RE = Sm, Gd, Dy, Y, Yb) on EuBCO/Ag Superconducting Bulks.

  • Source: IEEE Transactions on Applied Superconductivity. Jun2021, Vol. 31 Issue 4, p1-5. 5p.

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Conference

Microstructure investigation of reference voltage and leakage current trends in varistor arresters

  • Source: 2021 IEEE Electrical Insulation Conference (EIC) Electrical Insulation Conference (EIC), 2021 IEEE. :342-346 Jun, 2021

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Conference

Investigation and Comparison of Aging Effects in SAC+Bi Solders Exposed to High Temperatures

  • Source: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic

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  • 1-10 of  183 results for "eds"