HFGCN: High-speed and Fully-optimized GCN Accelerator

• Authors : Han, MinSeok; Kim, Jiwan; Kim, Donggeon

• Source: 2023 24th International Symposium on Quality Electronic Design (ISQED) Quality Electronic Design (ISQED), 2023 24th International Symposium on. :1-7 Apr, 2023

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Cache Register Sharing Structure for Channel-level Near-memory Processing in NAND Flash Memory

• Authors : Kim, Hyunwoo; Lee, Hyundong; Kim, Jongbeom

• Source: 2023 24th International Symposium on Quality Electronic Design (ISQED) Quality Electronic Design (ISQED), 2023 24th International Symposium on. :1-6 Apr, 2023

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Efficient Hardware Acceleration of Chinese Remainder Theorem for Fully Homomorphic Encryption

• Authors : Kim, Hyunwoo; Park, Seong-Cheon

• Source: 2023 International Conference on Electronics, Information, and Communication (ICEIC) Electronics, Information, and Communication (ICEIC), 2023 International Conference on. :1-4 Feb, 2023

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A Study on Axial Type Servo Motor for Current Density and Torque Ripple Reduction through Magnet Shape

• Authors : Kang, Junho; Kim, Hyunwoo; Jung, Dong-Hoon

• Source: 2022 25th International Conference on Electrical Machines and Systems (ICEMS) Electrical Machines and Systems (ICEMS), 2022 25th International Conference on. :1-4 Nov, 2022

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Design and Analysis of Line-Start Synchronous Reluctance Motor Considering the Maximum Inertia and Power Factor

• Authors : Kim, Hyunwoo; Ahn, Jungho; Kim, Jeongwon

• Source: 2022 IEEE Energy Conversion Congress and Exposition (ECCE) Energy Conversion Congress and Exposition (ECCE), 2022 IEEE. :1-6 Oct, 2022

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Power Distribution Network Impedance Analysis considering Thermal Distribution

• Authors : Son, Keeyoung; Lho, Daehwan; Kim, Keunwoo

• Source: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2022 IEEE Electrical Design of. :1-3 Dec, 2022

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Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module

• Authors : Kim, Hyunwoo; Kim, Haeyeon; Park, Joonsang

• Source: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2022 IEEE Electrical Design of. :1-3 Dec, 2022

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A Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling

• Authors : Kim, Keunwoo; Lee, Junghyun; Hong, Seokwoo

• Source: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2022 IEEE 31st Conference on. :1-3

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Self-positioning Point-based Transformer for Point Cloud Understanding

• Authors : Park, Jinyoung; Lee, Sanghyeok; Kim, Sihyeon

Subjects: Computer Science - Computer Vision and Pattern Recognition

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MELTR: Meta Loss Transformer for Learning to Fine-tune Video Foundation Models

• Authors : Ko, Dohwan; Choi, Joonmyung; Choi, Hyeong Kyu

Subjects: Computer Science - Computer Vision and Pattern Recognition

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