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Conference

Edgebond adhesive enhances the reliability of low-temperature solder in board-level assembly (IMPACT 2022)

  • Source: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th

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Thermal cycling induced interconnect stability degradation mechanism in low melting temperature solder joints

  • Source: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1199-1205 May, 2022

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Evaluation of Low-k Integration Integrity Using Shear Testing on Sub-30 Micron Micro-Cu Pillars

  • Source: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :811-815 Jun, 2021

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An Effective and Application-Specific Evaluation of Low-k Dielectric Integration Integrity using Copper Pillar Shear Testing

  • Source: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1517-1524 Jun, 2020

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Stress and Strain Level Evolution and Correlation to Void Migration in Solder Bumps after Various Thermo-mechanical Post Treatments

  • Source: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :570-573 Dec, 2019

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Microstructure Signature Evolution in Solder Joints, Solder Bumps, and Micro-Bumps Interconnection in A Large 2.5D FCBGA Package During Thermo-Mechanical Cycling

  • Source: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1099-1105 May, 2019

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Long-Term Reliability of Solder Joints in 3D ICs Under Near-Application Conditions

  • Source: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1106-1112 May, 2019

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Impact of press-fit connector pin microstructure elastic response to PCB through-hole Cu wall interface long-term contact reliability

  • Source: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :890-893 Dec, 2018

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Academic Journal

Mg effect on the cryogenic temperature toughness of Al-Mg alloys

  • Source: In Materials & Design December 2022 224

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Academic Journal

What Clinicians Should Consider When Performing Oblique Lumbar Interbody Fusion in a Patient with Long Vertebral Body Osteophytes

  • Source: In World Neurosurgery July 2022 163:e450-e457

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  • 1-10 of  128 results for ""Lee, Tae-Kyu""