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Academic Journal

Nanotech Commercialization in the United States [Commercialization]

Subjects: Components, Circuits, Devices and Systems; Computing and Processing; Commercialization

  • Source: IEEE Nanotechnology Magazine IEEE Nanotechnology Mag. Nanotechnology Magazine, IEEE. 4(2):24-30 Jun, 2010

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Academic Journal

Guest Editorial Automation in Automotive Manufacturing

Subjects: Robotics and Control Systems; Manufacturing automation; Automotive engineering

  • Source: IEEE Transactions on Automation Science and Engineering IEEE Trans. Automat. Sci. Eng. Automation Science and Engineering, IEEE Transactions on. 7(4):721-723 Oct, 2010

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Academic Journal

Guest Editorial

Subjects: Power, Energy and Industry Applications; Signal Processing and Analysis; Communication, Networking and Broadcast Technologies

  • Source: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 57(1):3-5 Jan, 2010

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Academic Journal

Full-Field 3-D Flip-Chip Solder Bumps Measurement Using DLP-Based Phase Shifting Technique

Subjects: Components, Circuits, Devices and Systems; Phase measurement; Semiconductor device measurement

  • Source: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 31(4):830-840 Nov, 2008

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Academic Journal

Intelligent User Support in Autonomous Remote Experimentation Environments

Subjects: Power, Energy and Industry Applications; Signal Processing and Analysis; Communication, Networking and Broadcast Technologies

  • Source: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 55(6):2355-2367 Jun, 2008

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Academic Journal

Approach for a Standardized Methodology for Multisite Processing of 300-mm Wafers at R&D Sites

Subjects: Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Research and development

  • Source: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 20(3):215-221 Aug, 2007

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